Feature of Gigabyte X570 I Aorus Pro WiFi DDR4

1. Supports AMD 3rd Gen Ryzen™/ 2nd Gen Ryzen™/ 2nd Gen Ryzen™ with Radeon™ Vega Graphics/ Ryzen™ with Radeon™ Vega Graphics Processors
2. Dual Channel ECC/ Non-ECC Unbuffered DDR4, 2 DIMMs
3. Direct 8 Phases IR Digital VRM Solution with PowIRstage
4. Advanced Thermal Design with Extended & Multi-Layered Heatsink
5. Dual Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with one Thermal Guard
6. Intel® WiFi 6 802.11ax 2T2R & BT 5
7. ALC1220-VB Enhance 114dB(Rear)/ 110dB(Front) SNR in Microphone with Nichicon Audio Capacitors
8. Intel® GbE LAN with cFosSpeed Internet
9. RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Supports Addressable LED & RGB LED Strips
10. Smart Fan 5 features Multiple Temperature Sensors and Hybrid Fan Headers with FAN STOP
11. Rear USB 3.1 Gen2 Type-C™ Header & HDMI 2.0 support
12. Integrated Base Plate & I/O Shield Armor
13. Q-Flash Plus update BIOS without installing CPU, Memory and Graphics card

GET READY FOR AMD RYZEN™ 3000-SERIES

GIGABYTE X570 I Aorus Pro Wifi DDR4 motherboards based on the AMD X570 Chipset provide full support for 3rd Gen AMD Ryzen™ Processors. The all-new design is a testament to GIGABYTE's dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0 and USB Type-C™ interfaces on select boards, refined audio, high speed of Ethernet and latest standard of WIFI design, to fulfill users' performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzen™ 3000-series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system.

AMD StoreMI Technology

GIGABYTE X570 motherboards maximize your PC's potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC to a performance driven system.

Ultimate Power Design

To unleash the full potential of the 3rd Generation of AMD Ryzen™ CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, the X570 AORUS is a true beast among motherboards.

Advanced Thermal Design

On a small mini-ITX board, heat is easily trapped and thermal balance is not easy to achieve. To avoid thermal throttle, an improved thermal solution consisting of a heatsink with cuts, and multi-layered heatsink has been implemented on the X570 I AORUS PRO WIFI. With a LAIRD 1.5mm thick, 5W/mK high thermal conductivity pads, it can transfer 2.7x more heat compared to traditional thermal pads in the same time period.

Specifications of Gigabyte X570 I Aorus Pro WiFi DDR4