With faster computations, it also means reduced power consumption, making it more environmentally friendly and energy-efficient, continuously contributing to the well-being of our planet.

AI-Driven PCB Technology -Redefining PCB Design with Artificial Intelligence

AI-Driven PCB Technology employs AI algorithms to optimize vias, routing and stackups. It ensures peak performance and signal integrity across single and cross-layer throughout the design process.

AI-ViaFusion Technology

Optimized vias & pads for signal integrity

AI-Trace Technology

Smart routing for peak performance

AI-Layer Technology

Tailored stackups for enhanced functionality

Key Features:
AI-Generated Design Recipes
AI-Driven Simulation
AI-Powered Signal Verification
Single and cross-layer signal optimization

AI-ViaFusion™ Technology - AI-Powered Excellence in Signal Integrity

Reduction in Signal Reflection Up to 28.2%
AI-ViaFusion, an AI-assisted via optimization technology, determines optimal via and pad sizes across PCB areas. This technology enhances cross-layer signal integrity and transmission efficiency, outperforming traditional design methods.

Best-in-class Signal Quality

• Superior signal transmission efficiency
• Dramatically reduced signal reflection
• Elevated signal quality and reliability
• Enhanced cross-layer PCB signal performance

Optimized Via Design

Varied via sizes for optimized signal and power paths

Driven Pad Optimization

Custom pad sizes for performance and production balance

Precision Impedance Matching

Via & pad sizes selected for optimal signal impedance

Minimized Insertion Loss

Optimized vias reduce signal loss

Enhanced Return Loss

Precision impedance matching reduces reflections

Optimized Eye Diagram

Wider eye opening improves signal integrity

Vias (Vertical Interconnect Access) are critical for multi-layer PCB connectivity. Via size significantly impacts signal integrity, affecting capacitance, reflections, and crosstalk.

AI-ViaFusion Technology optimizes PCB performance through:

Strategic Via Sizing

Optimized for varied signals across PCB

Enhanced Impedance Matching

Precise control via machine learning

Space Optimization

Maximized layout efficiency with signal integrity

Fiber Weave Effect Mitigation

Optimized signal synchronization

Shielded Memory Routing

Optimized signal shielding and precision

Impedance-Optimized Topology

Refined traces with minimal resistance

Isolated Memory Routing

Optimized trace layout and layer separation

Daisy-Chained Routing

Innovative design eliminates signal bottlenecks

Experience next-gen PCB routing with GIGABYTE's AI-Trace Technology.

Mitigating Fiber Weave Effect with AI-Trace Technology

Fiber Weave Effect in high-speed PCBs stems from varying dielectric constants of epoxy resin and glass fibers, this causes varying signal propagation speeds, leading to signal integrity issues such as crosstalk and jitter. AI-Trace Technology implements innovative routing angles to mitigate this effect.

Benefits of Mitigation:

Reduces signal distortion

Improves transmission reliability

Supports higher data rates

Enhances overall system stability

AI-Layer Technology -Next-Generation Multi-Layer PCB Design

AI-Layer Technology creates innovative layer materials for multi-layer PCBs, delivering unparalleled performance.

Core Innovation:
AI-Optimized Layer Customized Design

• AI-optimized layer design
• Unique material for each layer
• AI-verified signal integrity
• Tailored PCB for peak performance

Key Features:
AI-optimized PCB layer and design material
Server-Grade Low Loss PCB*
Enhanced 2X Copper Technology

Advanced full-metal thermal design and durable heatsinks to keep your system cool and efficient